SODIMM?(small outline dual in-line memory module) Notebook RAM ประวัติการพัฒนา แรม ของบริษัท Kingston BGA (Ball Grid Array) – A chip package having solder balls on the underside for mounting. BGA allows for a reduction in die package size, better heat dissipation, and greater module densities. Chip-Scale Package (CSP) – Thin chip packaging whereby electrical connections are…