SODIMM Kington

SODIMM?(small outline dual in-line memory module)

Notebook RAM

ประวัติการพัฒนา แรม ของบริษัท Kingston

BGA (Ball Grid Array) – A chip package having solder balls on the underside for mounting. BGA allows for a reduction in die package size, better heat dissipation, and greater module densities.

Chip-Scale Package (CSP) – Thin chip packaging whereby electrical connections are typically through a ball grid array. Chip-scale packaging is used in RDRAM and flash memory.

DDR (Double Data Rate Memory) – The latest generation of SDRAM technology. Data is read on both the rising and the falling edge of the computer clock, thereby delivering twice the bandwidth of standard SDRAM. With DDR SDRAM, memory speed doubles without increasing the clock frequency.

DIMM (Dual In-line Memory Module) – A printed circuit board with gold contacts and memory devices. A DIMM is similar to a SIMM, but with this primary difference: unlike the metal leads on either side of a SIMM, which are “tied together” electrically, the leads on either side of a DIMM are electrically independent.

DRAM (Dynamic Random-Access Memory) – The most common form of RAM. DRAM can hold data for only a short time. To retain data, DRAM must be refreshed periodically. If the cell is not refreshed, the data disappear.

Megabyte (MB) – The most common term used to denote the capacity of a memory module. 1 megabyte equals approximately one million bytes, or exactly 1 byte x 1,0242 (1,048,576) bytes.

Memory – A computer’s random-access memory. Memory temporarily holds data and instructions for the CPU. Also referred to as memory module. See RAM.

Memory Bank – A logical unit of memory in a computer, the size of which the CPU determines. For example, a 32-bit CPU requires memory banks that provide 32 bits of information at a time. A bank can consist of one or more memory modules.

Micro BGA (?BGA) – Tessera, Inc. BGA chip packaging technique that allows for a reduction in die package size, improved heat dissipation, and greater module densities.

MicroDIMM (Micro Dual In-Line Memory Module) – Smaller than an SODIMM, MicroDIMMs are primarily used in sub-notebook computers. MicroDimms are available in 144-pin SDRAM (up to 133MHz from Kingston) and 172-pin DDR (up to 333MHz from Kingston).

Motherboard – Also known as the logic board, main board, or computer board, the motherboard is the computer’s main board and in most cases holds all CPU, memory, and I/O functions or has expansion slots for them.

RAM (Random-Access Memory) – A memory cell configuration that holds data for processing by a central processing unit (CPU). Random means the CPU can retrieve data from any address within RAM. Also see Memory.

RIMM? ( memory Module) – The trademarked name for a Direct Rambus memory module. A RIMM? conforms to the DIMM form factor and transfers data 16 bits at a time.

SDRAM (Synchronous DRAM) – A DRAM technology that uses a clock to synchronize signal input and output on a memory chip. The clock is coordinated with the CPU clock so the timing of the memory chips and the timing of the CPU are in synch. Synchronous DRAM saves time in executing commands and transmitting data, thereby increasing the overall performance of the computer. SDRAM allows the CPU to access memory approximately 25 percent faster than EDO memory.

SODIMM (Small-Outline Dual In-line Memory Module) – An enhanced version of a standard DIMM, as they are smaller and thinner than a DIMM and are used primarily in notebook computers. A 72-pin small-outline DIMM is about half the length of a 72-pin SIMM. 144-pin and 200-pin modules are the most common SODIMMs today.

TSOP (Thin Small-Outline Package) – A DRAM package that uses gull-wing leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The TSOP package is one-third the thickness of an SOJ. TSOP components commonly occur in small-outline DIMMs.

October 1987 – Kingston was the first memory manufacturer to offer lifetime warranties on our memory modules, including modules for notebooks.

October 1996 – Toshiba? America Information Systems selected Kingston as the official designer and manufacture of NoteWorthy? memory upgrades for Toshiba’s entire line of notebooks and desktops. The Kingston and Toshiba agreement marked the first formal endorsement of a memory manufacturer by a major PC company.

February 2000 – Kingston was the first memory manufacturer to offer low-profile PCB 256MB PC100 SODIMM for notebook computers. This allowed users to surpass any current notebook upgrade options by doubling the PC manufacturer’s capacity in most cases. Modules supporting notebooks by Compaq, Dell, IBM and Toshiba.

February 2000 – Kingston is the first to design a 512MB SODIMM memory module for the Apple? PowerBook? G3. Kingston worked in conjunction with Apple on the development of this module and increased Apple’s maximum upgrade capacity from 512MB to 1024MB. Not only was it the first time that a 512MB module was available for the PowerBook, but marked the first time in history that any notebook reached the 1GB memory capacity, even greater than Apple’s original specs.

April 2001 – Kingston is First to offer System Validated SO-RIMM modules.(Rambus)

April 2001 – Kingston First to design a new low-profile 1.25″ 512MB PC133 SO-DIMM supporting the Apple Titanium PowerBook G4, first to bring it to 1GB. Again working in with Apple directly to maximize the memory capacity of PowerBook G4.

July 2001 – Kingston chosen by Viewsonic as the preferred memory upgrade option for their Super PDA, Tablet PC and PDA products.

August 2001 – Kingston ships smallest low-profile PC100/133 SO-DIMM memory modules using CSP Technology.

October 2001 – Kingston announces DDR PC1600 and DDR 2100 SO-DIMM development modules.

November 2001 – Kingston ships PC2100 MicroDIMMs.

March 2002 -Kingston Announces DDR SO-DIMM Modules up to 512MB.

April 2002 – Kingston Releases 1 and 2GB Low-Profile DDR PC2100 Registered ECC memory modules.

July 2002 – Kingston announces proprietary elevated package over CSP (EPOC) technology enabling high capacity, 1.2 inch high registered memory modules.

August 2002 – Kingston releases 1st DDR333 memory supporting new Apple PowerMac G4, supporting up to 2GBs of DDR memory.

March 2003 – Kingston offers high capacity monolithic SDRAM for strategic notebook OEMs. The first independent memory manufacturer to offer 1GB SODIMMs for notebook OEMs as base memory and for customer upgrades. 1GB upgrades are available for PC models made by Apple, Dell, HP/Compaq, IBM, Sony and Toshiba.

March 2003 – Kingston announces 1GB 266MHz PC2100 SODIMM memory modules.

April 2003 – Kingston announces validated SODIMM memory modules for Intel Centrino mobile technology platform.

March 2004 – Kingston launches new DDR2 memory modules including 533MHz SODIMMs that offer faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance.